Unigen Corporation has announced a family of Flash drives in diverse form factors and densities, under the Armour brand.

ARMOUR Products & Applications

Oil and Gas

The Armour brand of Flash drives are designed for high reliability and mission critical applications such as military, aviation, industrial automation, oil & gas exploration, transportation and medical. This brand of Flash drives encompasses Rugged SSDs in 1.8" and 2.5" form factors, with SATA II and SATA III interfaces, and in densities up to 512GB; USB up to 64GB, SATADOM up to 32GB, mSATA up to 256GB, CF cards up to 128GB, and other custom form factors.


The drives are tested to meet MIL-STD-810 Shock & Vibration, Low Temperature and Thermal Shock. All BGA components are treated with epoxy based underfill and are optionally treated with conformal coating to MIL-I-46058C, or encapsulated for superior thermal and corrosion protection.


The drives may be individually customized with optional features such as type of NAND Flash (SLC/eMLC/MLC), components that meet either commercial or industrial temperature ranges, data encryption, and power loss protection. Features such as Secure Erase, Sanitize, Self-Encrypt and Decrypt are also offered on SSDs upon customer request.

Rugged Notebook

Unigen's patented EnduraCharge� technology is deployed on some SSDs to prevent corruption or data loss in the event of an unintentional power interrupt. This technology totally eliminates unscheduled downtime for drive reformatting and reinstalling system OS.

ARMOUR Product Certifications

Unigen's Armour product line of rugged DRAM and flash modules have been tested and certified by independent labs to meet MIL-STD-810 requirements for shock, vibrations, low temperature, thermal cycling and other harsh environmental conditions.

Shock, per MIL-STD-810, Method 516.6, procedure V, was successfully performed on products with and without underfilled BGA packages.
Random vibrations, per MIL-STD-810, Method 514.6, was successfully performed on products with and without underfilled BGA packages.
Thermal Shock, per MIL-STD-810, Method 503.5 was successfully performed on products with and without underfilled BGA packages.
Low Temperature Testing involved subjecting the product to extreme cold of -51�C in a chamber for a period of 24 hours. Inspection of the samples showed no physical or functional degradation.

Unigen offers a number of customer specific options on its rugged products.
The underfill option on BGA packages allows for increased shock resistance. The conformal coating per MIL-I-46058C protects the internal circuitry from environmental degradation. Additionally, Unigen offers optional encapsulation of components for superior thermal and corrosion protection. Besides these environmental options, Unigen can deliver a wide variety of electrical upgrades such as extended temperature screening (-40�C - +85�C), burn-in, and thermal sensors on DRAM modules. Unigen's line of DRAM modules and Flash SSDs are offered in a wide range of form factors to meet the needs of ruggedized industrial, embedded and networking applications.